Taiwan Denies Agreement on Semiconductor Production in US
Following her return from Washington, Vice Premier Cheng Li-jung clarified that their negotiation team had never agreed to a “50-50 chip split commitment.”
She emphasized that the topic was not brought up during the latest discussions and that Taiwan would not accept such terms.
“I think this is the US's idea. Our negotiation team has never made a 50-50 chip split commitment. Please rest assured that we did not discuss this issue this time, and we will not agree to such conditions. Please rest assured,” Cheng stated firmly.
Her comments came in response to remarks by US Secretary of Commerce Howard Lutnick, who claimed to have suggested a 50-50 division in semiconductor manufacturing to Taiwan.
Cheng also mentioned that once both parties achieve full agreement on reciprocal tariffs and supply chain collaboration, they would proceed to a final meeting aimed at securing a trade deal.
Currently, Taiwan’s exports to the US face a 20% tariff.
Taiwan accounts for more than half of the global semiconductor production, with a significant portion of its exports to the US being information and communications technology products, including chips.
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